Description
An radio frequency identification (RFID) tag is typically composed of a silicon die (chip) and an antenna that are manufactured at two different locations and later connected together. This involves manufacturing two different components that then must be attached to a substrate (tag) and connected together. This technology is an improvement of this process.Described are methods of making an electronic device including an electronic component, such as an IC chip, connected to conducting traces provided on a substrate by depositing an electrically conductive polymer deposited onto the substrate. The electronic component may be placed on the substrate before or after the electrically conductive polymer is deposited. Once deposited, the electrically conductive polymer is cured. The electrically conductive polymer may be deposited in a number of ways, such as using a mask having a desired pattern and applying the electrically conductive polymer to the mask, by screen printing the electrically conductive polymer or by printing the electrically conductive polymer using ink jet printing techniques.
IP Status
https://patents.google.com/patent/US7722920B2
