University of Pittsburgh researchers designed a new polymer-based buckling-resistant intracortical microelectrode array (MEA) for use in brain-machine interface applications.
Description
Neurological disorders impact up to one billion people (approximately 1 in 6), with an estimated global economic burden of $800bn. MEAs can allow for treatment and study of neurological disorders via high resolution interfacing with the brain. Current MEAs can disrupt native brain tissue and rupture the blood brain barrier potentially causing secondary complication. Finding better approaches for implanting MEAs remains an unmet need with the potential to improve treatment options and better research tools for neurological conditions.
Applications
• Connection of assistive technologies to the brain
• Research of neurological disorders
Advantages
MEAs have been developed and used over the last few decades but are not without problems. Silicon-based MEAs trigger a foreign body response (FBR) and act as a cantilever during micromotions of the brain leading to persistent inflammation. Soft polymer based MEAs are less likely to cause FBR but are difficult to insert and often buckle before penetrating the brain. To overcome this issue, insertion shuttles have been used although these can also cause brain injury and complicate the surgical procedure.
Using the mechanics of column buckling, this novel design featuring a shank with a T-shaped cross section has demonstrated resistance to buckling during the insertion process for more successful implantation of brain probes. This novel MEA has the potential to overcome many of the known problems with existing MEAs through a more simplified procedure, reduced brain trauma during insertion, and reduced risk of FBR.
In addition, the T-shaped cross section allows higher density packing of information channels ensuring higher bandwidth communication between brain-machine interfaces, allowing for more complex brain mechanisms to be studied.
Invention Readiness
In vitro testing has shown the device can be successfully implanted with a considerably reduced risk of buckling. In vivo insertion without assistive devices has been demonstrated. A T-shaped device has been developed and microfabricated with multiple layers of gold and palladium, using aluminum and aluminum oxide for hard masking and etching. In vitro testing has shown this novel T-shaped design is inserted more successfully than standard flat design. Preliminary testing has shown the novel device can have 10 times higher buckling strength than current state-of-the-art devices.
IP Status
https://patents.google.com/patent/WO2024103054A2
