The technology features a bistable, arch-shaped actuator that utilizes a snap-through mechanism activated by low-voltage resistive heating. Its core is a liquid crystalline polymer layer configured either as dual films with twisted or splayed nematic alignments or as a single film with a supertwisted nematic configuration, all sandwiched between optically transparent conductive layers such as ITO, graphene, or carbon nanotubes. When a small current (1–10 V, around 10 mA) is applied to selected regions, the resulting heat induces a controlled deformation in the polymer, enabling applications like haptic feedback, dynamic 3D display effects, and localized buckling in continuous films.
Description
This approach is differentiated by integrating clarity with responsive mechanical adaptability in a compact design. By overcoming challenges associated with broad wavelength optical transmission and energy efficiency, it facilitates advanced user interfaces in wearable technology, smart devices, and interactive displays. The ability to precisely control three-dimensional shapes and tactile sensations while retaining visual transparency marks a significant leap forward in developing intuitive, high-performance display systems for next-generation applications.
Applications
- Haptic feedback interfaces
- 3D pop-up displays
- Transparent interactive panels
- Wearable smart displays
Advantages
- Low-voltage, energy-efficient operation (1–10V, ~10mA) reduces power consumption.
- Optical transparency enables integration with clear display surfaces using materials like ITO, graphene, or carbon nanotubes.
- Bistable snap-through mechanism provides rapid and robust state transitions for responsive haptic feedback and 3D effects.
- Versatile design supports various configurations—including individually addressable haptic arrays, dynamic 3D pop-up displays, and continuous film applications.
- Compact form factor and adaptable liquid crystalline polymer (LCP) configurations offer integration into wearable tech and advanced user interfaces.
IP Status
https://patents.google.com/patent/US11739268B2
