The Sequential Cold Spray Laser Sintering (SCSLS) is an innovative additive manufacturing (AM) method developed to overcome the limitations of existing metal-based AM processes.
Description
By combining cold spray deposition with precision laser sintering, SCSLS enables the creation of robust, high-quality 3D structures with reduced porosity and enhanced mechanical properties. This technology is particularly advantageous for manufacturing in both terrestrial and microgravity environments, offering significant potential for various industrial applications.
Applications
• Medical Devices
• Drug Delivery/Formulation
• Engineering Technology
Advantages
The SCSLS technology offers several unique advantages over traditional AM methods. Firstly, it combines the benefits of cold spray deposition and laser sintering, resulting in a robust and resilient printing process that is less sensitive to environmental conditions. This hybrid approach allows for the use of a wider range of materials, including reactive metals, without the need for tightly controlled inert environments. Additionally, the SCSLS process significantly reduces porosity and enhances the mechanical properties of the printed structures, making them suitable for industrial applications. For example, the ability to use magnesium and aluminum with improved oxide removal and particle coalescence demonstrates the potential for high-strength, lightweight components in aerospace and automotive industries.
Invention Readiness
The SCSLS technology is currently in the development stage, with successful demonstrations of cold spray deposition using various materials such as magnesium, aluminum, copper, stainless steel, and Inconel. Preliminary data has shown promising results in terms of oxide removal, particle coalescence, and laser sintering precision. Ongoing work focuses on optimizing the processing parameters and integrating the steps into a contained process for creating complex 3D shapes. The next steps involve mechanical testing and validation to further understand the process and enhance its readiness for commercial applications.
IP Status
https://patents.google.com/patent/US20230073429A1
