Fabrication Method of Carbide Ceramics for Additive Manufacturing and Carbide-Carbide Joining
This technology utilizes a specialized precursor mixture composed of carbide particles, a pre-ceramic polymer, fine carbon, and metal nanoparticles to enable the joining and manufacture of carbide ceramics at temperatures below 1400°C. The process begins with impregnating a porous carbide preform, allowing the metal nanoparticles to coat larger grains. Heating to 1150–1400°C initiates a eutectic reaction, forming a transient liquid silicide phase that promotes enhanced diffusion and crystallization. As equilibrium is reached with available carbon, the liquid phase transforms into stable metal carbide phases, resulting in a dense, highly crystalline ceramic structure that facilitates both powder bed additive manufacturing and flexible bonding tape applications.
Description
This approach is differentiated by its significantly lower processing temperatures, pressureless sintering capability, and superior control over microstructure development compared to conventional methods. The precise management of phase reactions reduces shrinkage, deformation, and residual stresses often seen in high-temperature ceramic processing. These characteristics open up new possibilities for creating complex, dimensionally stable ceramic components and robust joints, marking a substantial advancement for industries requiring high-strength, precise ceramic manufacturing and joining solutions.Applications
- Powder bed additive manufacturing- Flexible bonding tape production
- Low-temperature ceramic joining
Advantages
- Enables ceramic processing at lower temperatures, reducing energy consumption and thermal degradation risks.- Minimizes shrinkage, deformation, and residual stress for improved dimensional stability and structural integrity.
- Enhances densification and crystallinity through improved diffusion and controlled phase transformations.
- Offers versatile manufacturing options, supporting both powder bed additive manufacturing and effective ceramic joining via bonding tapes.
- Facilitates pressureless sintering, achieving high-density, durable ceramic structures without the need for external pressure.